| Item | Ability |
| Layer | 2~12L |
| Dimension | ~ 457X610mm |
| Thickness | 0.5 ~ 4.0 mm |
| Surface finish | Immersion gold, silver |
| Materials | PTFE+FR4
RO4350B+FR4 FR4 Multylayer |
| Hole zise Min | Non-copper block area 0.2mm
Copper block area 0.5mm |
| Aspect ratio Max | 12：1 |
| Special design | Buried copper (flatness ±0.05mm), part mixed lamination, Cavity |
| Reliability | Lead-free Reflow: 3 times without delamination
Thermal stress: 288℃*10s*3 times, no delamination |
| Application | Telcommunication, base station |
