Product

Smart Phone and HDI PCB Miracle Technology

Describe:System HDI

Categories: Tag:
Item Ability
Layer 2~12L
Board thickness 0.3mm
Copper tolerance ±8%
Solder mask tolerance ±10%
Minimum insulating layer thickness 2 mil
Drilling hole Aperture 0.15mm
Laser Drilling Aperture 0.076 mm
Line Width 50/50 um
Surface treatment ENIG,OSP
Special design 3+N+3,POFV,1+1+N+1+1,1+1+1+N+1+1+1
Materials IT158,IT150G,IT168G,IT170GLE,EM355D,EM390

GET IN TOUCH WITH US

Whether you have a question about our service or anything else our team is ready to answer all your questions!